Munich, January 20, 2026 – ASMPT SMT Solutions, a leading global provider of integrated hardware and software solutions for electronics manufacturers, officially launched its new SIPLACE V platform. This platform offers up to 30% performance improvement, combining the highest speed, highest quality, and flexibility. With its compact design, full compatibility with existing ASMPT solutions, and long-term investment protection, ASMPT is setting a new benchmark for electronics manufacturing.
Next-Generation Placement Head
The key to the SIPLACE V platform's performance improvement lies in ASMPT's continuous refinement of its placement head technology. The SIPLACE CP20 pick-and-place head sets a new benchmark for high-speed applications with placement speeds up to 52,500 components per hour and an accuracy of 25 µm @ 3σ.
The highly flexible SIPLACE CPP placement head can be switched between pick-and-place, pick-and-place, and mixed modes via software control. This versatility makes it ideal for complex mixed placement applications, with processing speeds up to 28,000 components per hour and placement forces up to 15 Newtons.
The SIPLACE TWIN VHF is designed specifically for exceptionally large and uniquely shaped components. It reliably handles components up to 200 × 150 × 28 mm in size, with a placement force of up to 100 Newtons and extremely high precision. The SIPLACE V platform can process up to 6,000 components per hour, opening up new possibilities for manufacturers—for example, in handling complex components such as BGAs, which are playing an increasingly important role, especially in artificial intelligence applications.
With the SIPLACE V platform, ASMPT SMT Solutions sets a new benchmark for productivity and flexibility. It can handle a wide range of components, from ultra-small 016008M chips to large components, and excels particularly in handling demanding or uniquely shaped components. A universal placement head interface allows for quick head changes, facilitating easy operation even during operation. The equipment is available in single-gantry and dual-gantry versions and can be configured with single or dual conveyor systems. An optional 3D Koplan module is available to detect component and board warpage, ensuring reliable placement even at high speeds. An additional camera provides greater accuracy for specialized applications.
The platform is also compatible with a variety of PCB sizes. Dual conveyors can handle boards up to 400 × 280 mm, while a single conveyor can handle boards up to 700 × 530 mm. Furthermore, up to two tray units can be connected to each machine. Another major highlight is the significantly increased number of feed slots, allowing pins to be automatically picked up by the placement head, even without previously installed options such as intelligent pin supports, eliminating the need for a separate pin picker.
The ASMPT SMT solution integrates all these features within a footprint of only 1.1 × 2.4 meters, setting a new record for floor space productivity in the electronics manufacturing industry.
