SMT AOI/SPI/X-ray

Typical Inspection Applications

LT100 is commonly applied to detect:

• BGA and CSP solder joint voids

• SMT solder bridges and insufficient solder

• IC internal connection defects

• Hidden cracks and cold solder joints

• Semiconductor package anomalies

These inspection tasks are essential for quality assurance in high-reliability electronics production.

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Core X-Ray Imaging System

The LT100 X-Ray system integrates stable and proven imaging components:

• Sealed X-ray tube with up to 90 kV tube voltage

• Tube current up to 200 μA for clear penetration

• Fine resolution down to 5 μm

• Geometric magnification up to 125×

• Air-cooled system for stable long-term operation

This configuration allows clear visualization of complex internal structures without damaging the product.

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Flat Panel Detector Performance

The flat panel detector provides consistent image quality for inspection tasks:

• Image matrix: 1536 × 1536

• Pixel size: 85 μm

• Effective imaging area: 130 × 130 mm

• Frame rate: up to 20 fps

• A/D conversion: 16-bit

These specifications support smooth image acquisition and detailed defect analysis.

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Precision Motion and Manipulation Platform

LT100 is equipped with a multi-axis precision manipulation system:

• X-axis travel: 400 mm

• Y-axis travel: 450 mm

• Z-axis travel: 300 mm

• R-axis rotation: ±60° tilt and rotation

This allows flexible positioning of PCBs and components for multi-angle inspection.

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Control System and Operation

The system is designed for intuitive and precise operation:

• Image-guided navigation: “click-to-move” inspection positioning

• Full keyboard and mouse operation

• Teaching mode for repeatable inspection paths

• CNC automatic positioning for consistent results

These features help reduce operator dependency and improve inspection efficiency.

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System Dimensions and Power Requirements

• Machine size: approx. 1100 × 1255 × 1865 mm

• Weight: approx. 1100 kg

• Power supply: AC 110–230 VAC, 50/60 Hz

The enclosed X-ray cabinet ensures operator safety while maintaining compact factory footprint.

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Computer and Software Platform

• Industrial control computer

• Operating system: Windows 7

• CPU: Intel i5

• Memory: 4 GB

• Storage: 1 TB HDD

• Display: 23-inch monitor

The system supports stable operation and image processing for industrial environments.

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When LT100 Is the Right Choice

LT100 is suitable when:

• AOI cannot detect hidden solder defects

• BGA / CSP inspection is required

• Reliability standards are strict

• Root-cause analysis is part of the quality process

• Non-destructive inspection is mandatory

It is often used as a quality analysis and verification tool, rather than inline mass inspection.

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X-Ray Inspection as Part of a Quality System

X-Ray inspection is most effective when integrated into a broader quality strategy that includes:

• AOI and SPI inspection

• Process control and SPC analysis

• Engineering review and failure analysis

👉 For system-level planning, please refer to our Offline SMT Solutions and Factory Upgrade Projects.