The Inline 3D SPI V870 is a standard-type inline solder paste inspection system designed for full integration within high-throughput SMT production lines. It utilizes advanced optical measurement principles to accurately calculate solder paste volume and height on printed PCBs, ensuring print quality before placement and reflow.
Compared to standalone or offline SPI units, inline SPI like the V870 performs inspection directly in the production flow, enabling real-time process feedback and rapid quality control without interrupting PCB transfer.