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Process Optimization

SPI vs AOI Optimization – A Joint Strategy for Stable SMT Quality and Throughpu

SPI and AOI are often treated as independent inspection stations in SMT production.
In reality, SPI and AOI form a tightly coupled quality system—and optimizing one without considering the other often leads to false calls, inspection bottlenecks, and unstable production flow.

This article presents a joint SPI + AOI optimization strategy, explaining how to allocate inspection responsibility, tune parameters collaboratively, and improve both yield and line stability.


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1. Understanding the Different Roles of SPI and AOI

Before optimization, it is critical to understand what SPI and AOI are best at detecting.

SPI excels at:

  • Solder paste volume and height

  • Insufficient or excessive paste

  • Printing alignment issues

  • Early process deviation detection

AOI excels at:

  • Component presence and polarity

  • Placement offset and rotation

  • Solder joint shape and wetting

  • Post-reflow assembly defects

Optimizing both systems to detect the same issues leads to redundancy and instability.


2. The Common Mistake: Overlapping Inspection Responsibility

A frequent optimization error is:

  • SPI checking too many cosmetic details

  • AOI over-analyzing solder defects already controlled by SPI

This overlap increases:

  • Inspection time

  • False calls

  • Operator review workload

Effective optimization starts with clear inspection responsibility separation.


3. Define a Clear SPI–AOI Inspection Boundary

A joint strategy assigns responsibility deliberately:

Inspection ItemPrimary OwnerSecondary Role
Solder volume / heightSPIAOI trend check
Paste alignmentSPIAOI confirmation
Component presenceAOI
PolarityAOI
Solder joint shapeAOISPI trend reference
Process driftSPIAOI feedback

Clear boundaries reduce conflict between inspection systems.


4. Use SPI as a Process Control Tool, Not a Defect Gate

SPI should focus on:

  • Trend monitoring

  • Early warning of printing drift

  • Process stability indicators

Avoid using SPI as a hard pass/fail gate for cosmetic variation, which creates unnecessary NG boards.


5. Optimize AOI Based on SPI Feedback

SPI data can be used to:

  • Dynamically adjust AOI tolerance

  • Identify areas where AOI false calls can be relaxed

  • Detect real process drift vs normal variation

AOI should react intelligently to SPI trends, not operate blindly.


6. Reduce AOI False Calls Through SPI-Aware Programming

If SPI confirms stable paste conditions:

  • Relax AOI solder joint thresholds

  • Reduce false calls caused by acceptable variation

  • Focus AOI resources on placement-related defects

This coordination significantly improves AOI throughput.


7. Align SPI and AOI Cycle Time with Line Takt

Joint optimization must consider takt time:

  • SPI too slow → early bottleneck

  • AOI too strict → downstream blocking

Balancing both inspection speeds prevents accumulation and line stoppage.


8. Plan Recovery and Review Flow Together

SPI and AOI recovery logic should be aligned:

  • Clear rules for when boards stop the line

  • Defined escalation paths

  • Offline review for ambiguous cases

A shared recovery strategy reduces confusion and downtime.


9. Inline vs Offline Strategy in Joint Optimization

Inline SPI + AOI works best when:

  • Product mix is stable

  • Inspection programs are mature

Offline or hybrid strategies are better when:

  • False call rates are high

  • Engineering validation is ongoing

  • Line stability is at risk

Joint optimization includes choosing the right inspection mode.


10. KPIs to Monitor in SPI–AOI Joint Optimization

Key indicators include:

  • SPI trend deviation rate

  • AOI false call rate

  • Combined inspection cycle time

  • Line blocking incidents

  • First-pass yield (FPY)

Tracking both systems together reveals real improvement.


Conclusion

SPI and AOI should not compete—they should collaborate.

A joint optimization strategy:

  • Reduces false calls

  • Improves inspection efficiency

  • Stabilizes SMT line flow

  • Increases overall yield and ROI

True inspection optimization happens at the system level, not machine by machine.


Linking Suggested reading:


Thomao Engineering Insight

SPI controls the process.
AOI protects the result.
Optimization connects both.


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